CIOE Interview with Bozhon Semiconductor: Modular Design Enables Flexible Patch to Meet the Diverse Needs of Optical Module Customers

Interview with Bozhon Semiconductor: Leading 400G~1.6T Optical Module Packaging Technology Innovation

Bozon Precision Industry Leads Semiconductor Innovation Consortium and Contributes to the Development of Suzhou Innovation Consortium

To become a major country in the semiconductor industry, equipment must be prioritized

Focusing on car mounted LiDAR, Bozhon Semiconductor delves into optoelectronic device packaging