High Speed High Precision Epoxy Die Bonder

The FastStar series epoxy die bonder is a high-speed and high-precision equipment for multi-chip packaging, with an accuracy of ±7μm@3σ. It adopts open architecture and modular design, which can provide on-demand customization capability with extreme efficiency, and is compatible with up to 12-inch wafers to meet the encapsulation process of solidification, SiP, UV curing and other packaging processes.

High precision
High efficiency
High flexibility
Easy to expand

MicroStar EF8622
The EF8622 eutectic die bonder is mainly used in COC and COS process scenarios, providing high-precision mounting and multi feeding modes to solve customer pain points such as low yield and low production.
Product Parameters
  • ±1.5μm @ 3σ
    Placement accuracy
  • Eutectic/ Adhesive dipping
    Placement process
  • 15-25s (Eutectic)5-7s (Adhesive dipping)
    Efficiency

High precision

The repeated accuracy of the mounting air flotation platform is 0.5μm




High efficiency of eutectic

Twin eutectic platform

(The eutectic temperature between 200 and 340 ℃ only takes 3.2s to rise, and the cooling between 340 and 200 ℃ only takes 6.5s





Dynamic tool change

12 tool change chucks fully automatic tool change






Dual view module

Free switching of high and low magnification lenses (1&5x)




Free Proofing