From March 11th to 13th, the 2025 Munich Shanghai Light Expo (LASER World of PHOTONICS CHINA 2025) was grandly held at the Shanghai New International Expo Center. As a global grand event in the optoelectronic industry, this exhibition brought together leading enterprises from all over the world and showcased the latest technological achievements and innovative products.

Bozhong Semiconductor made an appearance with the theme of "All in one, Empowering the Transformation of Packaging Technology". It exhibited the new-generation MicroStar series EH8622 eutectic die bonder, the brand-new FastStar series DU9721 die bonding machine, as well as various die bonding solutions for scenarios such as optoelectronics, laser devices, and module mounting. It continued to send out signals of the new development trends in the industry!

Bozhong Semiconductor has always adhered to innovation as the driving force and closely followed the development trends of the industry. The Xingwei series eutectic die bonder equipment, as the company's star product, has successively launched multiple models for various sub - fields. Among them, the EF8621 equipment has been iteratively upgraded to the new - generation EF8622. The chip - mounting accuracy can reach ±1.5μm, achieving a leap of 50% improvement in accuracy. The mechanical structure, while retaining the double - station design, has added a streamline design. It can seamlessly connect to the AGV automatic loading and unloading system and supports seamless integration with other equipment on the production line to achieve efficient online production. This provides customers with more efficient and reliable solutions.

The newly launched FastStar Series DU9721 die bonder at this exhibition has become the focus of the event, attracting significant attention from industry experts, customers, and media, thanks to its outstanding performance and innovative design.

FastStar series die bonding machine,It adopts advanced visual recognition technology and adaptive algorithms, enabling precise positioning and rapid completion of chip mounting. The chip - mounting accuracy can reach ±7μm, and it is suitable for a variety of complex process scenarios. In addition, its modular design makes equipment maintenance more convenient and further reduces the operating costs for customers. This series of products not only achieves breakthrough improvements in accuracy and speed but also significantly increases production efficiency and the yield rate through an intelligent control system, meeting the mounting and manufacturing requirements of multiple scenarios such as IC chips, optical device modules, and Camera.

In addition, Bozhong Semiconductor also showcased its diversified product matrix. With the characteristics of high reliability, flexibility, and intelligence, these products bring brand - new mounting and inspection solutions to multiple fields.

The new - generation semiconductor packaging and testing solution of Bozhong Semiconductor will also make a grand appearance at SEMICON China 2025 from March 26th to 28th. You are welcome to visit the booth of Bozhong Semiconductor (Booth 5425, Hall N5, Shanghai New International Expo Center) to witness the brand - new semiconductor mounting and inspection solutions!